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适配 SMT 贴片、COB 固晶全工序；真空载台、精密定位，改善翘曲，提升贴装良率；支持定制，满足高精度显示制程需求。Suitable for full SMT mounting and COB die bonding processes. Featuring vacuum carrier and precision positioning, it mitigates substrate warpage and raises mounting yield. Customizable for high-precision display fabrication requirements.
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